Chart Venture Partners
CIA invests in power management firm
EE Times 08/06/2008
Mark LaPedus
Nextreme Thermal Solutions Inc. (Durham, N.C) , a developer of thermal and power management products, has secured $13 million in Series B financing.
The round was led by Chart Venture Partners. It also includes previous investors, such as Redshift Venture Partners, Harris & Harris Group, Inc., In-Q-Tel and RTI International, Itochu and Itochu Technology Ventures. In-Q-Tel is the venture capital arm of the U.S. Central Intelligence Agency.
The funding will be used to ramp Nextreme's products into full production in 2009.
Nextreme's thin-film thermoelectric products are manufactured with a so-called copper pillar bumping process. The process integrates thin-film thermoelectric material into the solder bumped interconnects that provide mechanical and electrical connections for today's circuits.
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